32440 |
Vicor Corporation |
11MM LONGITUDINAL FLOW HEAT SINK |
- |
7,488 |
APA501-60-001 |
Artesyn Embedded Technologies |
HEATSINK (60) 57.5X59X15MM VERT |
- |
8,964 |
PASLC |
TDK-Lambda Americas Inc. |
LOW CURRENT SOCKET |
- |
8,424 |
43809-06 |
Vicor Corporation |
HEAT SINK FOR DCDC CNVTR/ARRAYS |
- |
2,340 |
43809-08 |
Vicor Corporation |
HEAT SINK FOR DCDC CNVTR/ARRAYS |
- |
8,604 |
TD-CPU-192 |
Telcodium Inc. |
TELCODIUM CPU MODULE FOR MONITOR |
- |
7,110 |
PAH62L12 |
TDK-Lambda Americas Inc. |
HEATSINK THERMAL PAD KIT FOR DC/ |
- |
4,446 |
PAH83L23 |
TDK-Lambda Americas Inc. |
HEATSINK THERMAL PAD KIT FOR DC/ |
- |
5,058 |
MTF50 |
XP Power |
FILTER MODULE |
- |
6,606 |
MI-RAM-M1-S |
Vicor Corporation |
ATTENUATOR RIPPLE MODULE |
- |
8,640 |