Shenzhen GHG Innovation Technology Co., Ltd. follows a strict eight-step testing process in the quality control of chips and components to ensure that each product meets high standards of quality requirements.
So as to ensure the customer's product performance and market competitiveness. The specific quality control process is as follows:
Appearance detection
Our quality inspection personnel first conduct a comprehensive analysis of the appearance of the chip through a microscope and visual inspection to detect whether there are cracks, scratches, oxidation, contamination and other defects on the surface.
Ensure that the product is not damaged in physical condition and meets standards.
X-ray detection
Using X-ray imaging technology, non-destructive testing of solder joints and connections inside the chip is carried out to ensure the integrity of the internal structure.
Identify potential problems such as spot cracks, solder joints, and tinning to avoid reliability issues in subsequent production.
Weldability test
We perform weldability tests on the welded end of the chip to confirm the weldability of the pads and pins.
This step ensures that the chip can be stably mounted on the PCB board during the SMT process.
Avoid electrical connection instability or failure caused by poor welding.
Chemical opening test
In order to further analyze the internal structure of the chip, we use a chemical open-cap process to remove the chip packaging layer and reveal the core area inside the chip.
Scrutinize the bare chip under a microscope to identify possible internal defects in the manufacturing process, such as scratches on the chip surface, defects, or welding anomalies.
Ultrasonic scanning
Through ultrasonic scanning technology, each inner layer structure of the chip packaging layer is detected, and subtle defects such as bubbles, cracks and layers are identified.
Ultrasonic scanning can detect microscopic defects within the package, ensuring that the chip can withstand environmental and mechanical stresses in practical applications.
Elemental analysis
The material composition of the chip is analyzed using energy scattered X-ray (EDX) or other elemental analysis methods.
This step can detect whether the chip material meets the specified material standards, ensure the consistency and reliability of the material, and avoid the functional failure caused by the composition of the non-meeting the requirements.
Electrical performance test
We conduct a comprehensive test of the electrical performance of the chip through special equipment to measure various electrical parameters, ensuring that the chip's operating voltage, current and impedance performance meet expectations.
This test can detect components with substandard electrical performance in advance to ensure their stability in use.
Critical function test
Finally, we conduct in-depth tests on the core functions of the chip to confirm that it can achieve the intended function.
By simulating the working state of the chip in the actual use environment, the key parameters and functions are tested to ensure that the product can meet the customer's application requirements and use standards.